As of September 1, ASUS has officially taken over Intel's NUC brand and product range. Per the companies' [previously announced agreement](https://www.anandtech.com/show/18962/asus-signs-agreement-to-continue-nuc-dev-and-support), ASUS has become the de facto heir to Intel's NUC business, taking on the support obligations along with a non-exclusive license to build further NUCs. ASUS's newly introduced NUC series, in turn, features a diverse array of NUC PCs and compute elements aiming for a broad spectrum of needs, from business to gaming and beyond, all powered by Intel processors.

"Starting September 1st, NUC becomes a proud member of the ASUS product lineup, setting off on an exhilarating journey ahead," an [ASUS statement at Twitter reads](https://twitter.com/ASUSUSA/status/1697731070593228828). "Delve into NUC product specifics on the official ASUS website."

ASUStek's compact NUC offerings are designed for a wide variety of usage scenarios, including typical productivity at home or in office, gaming, edge computing, commercial, and even professional applications. ASUS also plans to keep providing NUC compute elements for custom commercial applications.

Although ASUS has rights to offer NUC PCs based on 10th, 11th, 12th, and 13th Generation Core CPUs, all systems featured on the ASUS NUC website are powered by Intel's 13th Generation Core 'Raptor Lake' processors. As noted previously, ASUS's agreement does require them to continue supporting the older NUCs (including hardware replacements, as warranties dictate), but they are not required to sell the older NUCs.

In any case, with Intel's 13th Generation Core CPUs having been out for a year now, the change in ownership is as good a time as any to tidy up the product line. Though like similar business handoffs in the past, this won't be an overnight change; none of the ASUS NUCs feature ASUS's logotype, and at least one machine still carries Intel's.

[![](https://images.anandtech.com/doci/20040/asus-nuc-hero-b_575px.jpg)](https://www.anandtech.com/show/20040/asus-takes-over-intel-nuc-brand)

ASUS [acquired](https://www.anandtech.com/show/18962/asus-signs-agreement-to-continue-nuc-dev-and-support) the NUC line after [Intel decided to step away from this segment](https://www.anandtech.com/show/18952/intel-set-to-exit-nuc-pc-business-pushes-partners-to-develop-more-sff-pcs) in mid-July. The two companies signed a non-exclusive agreement, allowing ASUS to manufacture existing NUC models and develop new ones, but leaves NUC doors open for other PC makers. Meanwhile, being a top PC maker ASUS is uniquely positioned to manage this line of products on a large scale.

Acquisition of Intel's NUC product range makes a great sense for ASUS, which has been losing market share in the recent years as it tried to focus on profitability. By taking over Intel's NUC business, ASUS is in a good position to increase its market share, while giving the NUC concept a new lease on life from a manufacturer who is more directly connected to the pre-built PC market.

ASUS Takes Over Intel NUC Brand, Begins the Next Era for the Next Unit of Computing

For this year's ChinaJoy expo, AMD is taking to the show to announce a new and very special mobile CPU for high-end, desktop replacement-class laptops: the Ryzen 9 7945HX3D, AMD's first V-cache-equipped mobile CPU. Slated to launch on August 22nd, the new chip is set to break new ground for AMD in the mobile space, all the while giving gamers an even more potent CPU for high-end gaming laptops.

Based on AMD's cutting-edge 3D V-Cache packaging technology, which places an additional slice of L3 cache on top of the existing L3 cache on the core complex die (CCD), the Ryzen 9 7945HX3D marks the first time AMD has brought their extended L3 cache technology to the mobile space. And like the Ryzen desktop parts already featuring this cache, such as the [Ryzen 9 7950X3D](https://www.anandtech.com/show/18747/the-amd-ryzen-9-7950x3d-review-amd-s-fastest-gaming-processor), AMD's aim is to offer buyers – and especially gamers – a top-end part that can offer even better performance in select classes of workloads that can take advantage of the additional cache.

The Ryzen 9 7945HX3D is joining AMD's current lineup of desktop replacement-class mobile SKUs, the [Ryzen 7045HX 'Dragon Range' series](https://www.anandtech.com/show/18716/amd-announces-ryzen-7045-hx-series-cpus-for-laptops-up-to-16-cores-and-5-4-ghz), as its new flagship mobile part. First introduced earlier this year, the AMD Ryzen 7045HX series is designed to offer desktop-grade hardware and desktop-like performance, marking the first time in the Zen era that AMD has offered its desktop silicon in a mobile chip. The entirety of the 7045HX series is based on repacked desktop silicon, and the new Ryzen 9 7945HX3D is no exception – for all practical purposes, we're essentially looking at a mobilized version of AMD flagship desktop part, the Ryzen 9 7950X3D.

AMD Ryzen 9 7945HX3D Is the First 3D V-Cache CPU for Laptops

AMD unveils its first laptop processor with 3D V-Cache

AMD’s Ryzen 9 7945HX3D could be its slam-dunk gaming laptop chip

AMD Unleashes The Ryzen 9 7945HX3D, First 3D V-Cache CPU For Laptops & Powers ASUS ROG SCAR 17 X3D

AMD officially unveils the new Ryzen 9 7945HX3D, the first mobile processor with 3D V-Cache

AMD Announces Ryzen 9 7945HX3D: Ryzen Mobile Gets 3D V-Cache

Sabrent has introduced one of the industry's first Thunderbolt 4 KVM switches, supporting displays up to 8K@60 Hz while also delivering 60W of power to host devices. The switch is aimed at creative professionals who want to use one monitor and set of input periphreals with two host computers. 

The Sabrent Thunderbolt 4 KVM Switch is a compact aluminum candy bar that has three Thunderbolt 4-certified USB Type-C ports supporting data transfer rates of up to 40 Gbps and DisplayPort 1.4 Alt Mode, as well as four USB 3.2 Gen 2 Type-A ports featuring a 10 Gbps speed. Notably, the full speed downstream Thunderbolt ports allow the switch to be used with 8K displays running at a full 60Hz refresh rate, which requires virtually the entire bandwidth of a TB4 port.

Meanwhile, to make it easier to switch between PCs, the KVM switch comes with an external button that can be placed everywhere on the desk.

[![](https://images.anandtech.com/doci/18933/71M-A-GpsXL._SL1500__575px.jpg)](https://www.anandtech.com/show/18933/sabrent-launches-thunderbolt-4-kvm-switch-with-8kp60-support)

The Thunderbolt 4 KVM Switch from Sabrent supports USB Power Delivery 3.0, allowing it to supply up to 60W of power to Thunderbolt 4-connected host. In addition, its USB Type-A ports also support Battery Charging 3.2 support and can deliver up to 12W of power to any connected device. The device comes with an 120W external power supply, which is quite large.

[![](https://images.anandtech.com/doci/18933/81XFhPX1nNL._SL1500__575px.jpg)](https://www.anandtech.com/show/18933/sabrent-launches-thunderbolt-4-kvm-switch-with-8kp60-support)

Sabrent's Thunderbolt 4 KVM Switch is not cheap: it has an MSRP of $299.99 and is among the most expensive devices of this kind on the market. The unit can be bought either directly from the company, or ordered from [Amazon](https://target.georiot.com/Proxy.ashx?tsid=45726&GR_URL=https%3A%2F%2Famazon.com%2Fdp%2FB0C74SWVD5%3Ftag%3Dhawk-future-20%26ascsubtag%3Danandtech-us-3542226837185510000-20).

Sabrent Launches Thunderbolt 4 KVM Switch with 8Kp60 Support

Qualcomm this morning is taking the wraps off its next generation Snapdragon 4-class mobile SoC, the aptly named Snapdragon 4 Gen 2. The company’s new entry-level SoC for smartphones and other devices incorporates some hardware updates that should modestly boost performance for the most cost-sensitive segment of the mobile market, as well as bringing Qualcomm’s overall Snapdragon product stack into closer alignment by supporting more recent 5G standards and fabbing the chip to a newer process node.

First and foremost, the top line on performance is that Qualcomm is touting a 10% boost in CPU performance, thanks to higher CPU core clockspeeds. The Snapdragon 4 Gen 2 uses the same 2+6 CPU core configuration as its predecessor, the [Snapdragon 4 Gen 1](https://www.anandtech.com/show/17560/qualcomm-unveils-snapdragon-6-gen-1-and-4-gen-1-socs), with 2 Cortex-A78-derived Kryo CPU cores paired with 6 Cortex-A55-derived cores. Thanks to a node shrink, Qualcomm has boosted the top clockspeeds on each set of cores by about 10%, bringing the A78 cores up to 2.2GHz, and the A55 cores up to 2.0GHz. So the 10% CPU performance gain should be fairly consistent in both single and multi-threaded workloads.

[![](https://images.anandtech.com/doci/18931/Snapdragon%204%20Gen%202%20Slides_11_575px.png)](https://www.anandtech.com/show/18931/qualcomm-unveils-snapdragon-4-gen-2-modest-modernization-for-lowend-mobiles)

Architecturally, there’s little to say about these cores that hasn’t been said already. These are reasonably performant CPU cores, though the age and the lack of higher clockspeeds means their performance potential is limited. The ultra-budget nature of the Snapdragon 4 series means this will be the last part of Qualcomm’s stack to move to any kind of Armv9 core. Though interestingly, the 4 Gen 2 does get a bit of a leg up over the 6 Gen 1 when it comes to the A55 cores – 6G1’s small cores only boost to 1.8GHz, despite being fabbed on the same process node. So this will narrow the CPU performance gap between those parts a bit (at least until the obligatory 6 Gen 2 lands).

Meanwhile, Qualcomm is staying mum on GPU performance. The company stopped giving their GPUs external product numbers a few years ago, and for the Snapdragon 4 release they are not even issuing performance expectations. So we aren’t expecting any gains here, especially as the chip is still meant to drive HD/FHD devices.

As noted earlier, Qualcomm has moved their entry-level SoC to a Samsung 4nm process (given the timing, 4LPP, we’d assume). That means that Samsung’s entire current product stack – Snapdragons 8G2, 7+G2, 6G1, and 4G2 – are all made on a 4nm node of some flavor. Samsung’s is the less performant of the two, but it’s almost certainly cheaper. Which is a boon for these entry-level, price-constrained parts. Academically, I’m curious just how small the Snapdragon 4 die is based on this process, as it should be rather tiny, but that’s not a detail Qualcomm normally shares.

Otherwise, this latest Snapdragon 4-class SoC is a bit of a give-and-take release as compared to the 4 Gen 1. On the memory side of matters, the new SoC incorporates Qualcomm’s newer controller design, bringing LPDDR5X support to a 4-class chip for the first time. Like other Qualcomm SoCs, the chip can run that memory at up to LPDDR5X-6400 speeds. Meanwhile, LPDDR4X remains supported as well, at the usual LPDDR4X-4266 data rate. The memory bus is still a total of 32-bits wide, so you’re looking at a peak memory bandwidth of 25.6GB/second with LPDDR5X, a full 50% more bandwidth than what the 4 Gen 1 could provide.

The storage controller has also been updated to support UFS 3.1, finally bringing Qualcomm’s low-end chip up to relatively modern version of the flash storage standard. Compared to the UFS 2.2 spec supported in the previous chip, UFS 3.1 a bit more than doubles the bandwidth per lane; so in a two-lane configuration, the 4G2 can theoretically transfer as much as 2.9GB/second of data though Qualcomm isn’t making any performance claims. Notably, eMMC storage support is absent from Qualcomm’s specification sheet, indicating that support for that now well-outdated interface standard is finally riding off into the sunset.

As for Qualcomm’s imaging ISPs and related hardware, the 4 Gen 2 will be taking a step backwards by removing the third camera pipeline. As a result, 4 Gen 2 will only support up to two cameras. The Spectra ISPs themselves are seemingly unchanged, with Qualcomm still using their 12-bit designs. Due to that camera shift, the overall imaging capabilities of the SoC have changed a bit, even in a two camera configuration. The resolutions supported in dual camera zero shutter lag mode are now balanced; rather than 25+13MPixels, the SoC runs at (up to) 16+16Mpixels.

Though with fewer camera modules to support, Qualcomm is touting better camera performance. In particular, Qualcomm says that the new SoC offers faster autofocus support than the 4 Gen 1, as well as an updated electronic image stabilization feature. The 4 Gen 2 also includes an “AI-enhanced” low light feature, and multi-camera temporal filtering (MCTF) support has been baked into the SoC for noise reduction.

The other major hardware improvement for the SoC, in turn, is an upgrade to a Snapdragon X60-series class modem. New to Qualcomm’s product lineup is the Snapdragon X61 modem, a downscaled version of their X62/X65 modem seem in other chips. Relative to the outgoing 4 Gen 1 SoC and its X51 modem, the X61 supports the newer Release 16 version (aka _5G Phase 2_) of the 3GPP standard family.

[![](https://images.anandtech.com/doci/18931/Snapdragon%204%20Gen%202%20Slides_10_575px.jpg)](https://www.anandtech.com/show/18931/qualcomm-unveils-snapdragon-4-gen-2-modest-modernization-for-lowend-mobiles)

Release 16 is now coming up on 3 years old, so this is a needed update to keep up with 5G network development. Though because the primary benefits of Release 16 are more for the network operations side than the consumer side, phone buyers don’t often see much from it besides some improvements in coverage. In the case of the 4 Gen 2, the actual bandwidth figures are unchanged from the 4 Gen 1, which means downloads and uploads top out at 2.5Gbps and 900Mbps respectively.

mmWave support has also remained off of Qualcomm’s spec sheets this time around. On the 4 Gen 1 it ended up being an unlisted feature of sorts – the hardware was there in case any handset vendor wanted to use it, but Qualcomm didn’t advertise it – and it’s unclear whether Qualcomm even bothered with the hardware for this new silicon.

Also of note: Bluetooth 5.2 support has disappeared from Qualcomm’s specifications. Whereas the 4 Gen 1 supported BT 5.2, across Qualcomm's documentation 4 Gen 2 is listed as only supporting BT 5.1. This is notable not only because it’s a regression, but because Bluetooth Low Energy Audio is a 5.2 feature – and arguably _the_ defining feature of 5.2. At this point it’s unclear why Qualcomm would want to remove the feature from their low-end SoC (I suspected royalties, but the LC3 codec for LE Audio is part of the BT license). Otherwise, the Wi-Fi half of Qualcomm’s radio system remains unchanged, with Wi-Fi 5 support.

[![](https://images.anandtech.com/doci/18931/Snapdragon%204%20Gen%202%20Slides_13_575px.jpg)](https://www.anandtech.com/show/18931/qualcomm-unveils-snapdragon-4-gen-2-modest-modernization-for-lowend-mobiles)

Wrapping things up, Qualcomm tells us that several of the usual suspects will be adopting the Snapdragon 4 Gen 2, including Redmi and vivo. Handsets based on the SoC are expected to be announced in the second half of this year.

Qualcomm introduces new Snapdragon 4 Gen 2 chipsets for budget-friendly phones

Qualcomm Snapdragon 4 Gen 2 brings a speed boost to budget phones (still tops out at WiFi 5)

Qualcomm Snapdragon 4 Gen 2: 4 nm SoC for budget smartphones is now official

Qualcomm Unveils Snapdragon 4 Gen 2: Modest Modernization For Low-End Mobiles

Despite running late and experiencing shipping delays, AMD's latest Zen 4 mobile chips with RDNA 3 graphics and Ryzen AI, the Ryzen 7040HS mobile chips, are becoming more widely available. Razer has adopted the Ryzen 7040HS series notebooks for its flagship Blade 14 model, which is powered by a Ryzen 9 7940HS and is available either with an NVIDIA GeForce RTX 4060 (140 W TGP) or the higher spec RTX 4070 (140 W TGP). Starting at $2400 and up to $2800, Razer claims the latest Blade 14 with the AMD Ryzen 7940HS is the most powerful Blade 14 they've ever created.

Outside of the latest Razer Blade 14 powered by AMD's Ryzen 7940HS 8C/16T mobile Zen 4 chip, it has seemingly felt like ages since [AMD first announced the Ryzen 7040HS series back at CES 2023](https://www.anandtech.com/show/18718/amd-2023-ryzen-mobile-7000-cpus-unveiled-zen-4-phoenix-takes-point). Expected back in Spring, AMD looks to have worked out any kinks and started shipping their Ryzen 7040HS mobile parts more widely to its partners and vendors, with various new notebooks from multiple vendors set to launch imminently.

Razer Blade 14 (2023) Launched, Combines Ryzen 9 7940HS with GeForce RTX 4070

New Razer Blade 14 arrives with Ryzen 9 7940HS and RTX 4070

Razer Blade 14 2023: Pre-orders open for new AMD Ryzen 9 7940HS gaming laptop with upgradeable RAM and storage

Razer’s Latest Blade 14 Cuts Deep With Ryzen 7940HS and RTX 4070 Muscle

Razer Updates The Blade 14 With Ryzen 9 7940HS, Up to RTX 4070 and 32 GB DDR5-5600

Intel and the Gordon and Betty Moore Foundation have announced this evening that Gordon Moore, Intel’s famous co-founder and grandfather to much of the modern chip industry, has passed away. According to the company he passed peacefully at his home in Hawaii, surrounded by his family.

Gordon Moore, Intel co-founder and creator of Moore’s Law, has died

Gordon Moore, Intel Co-Founder and Creator of Moore's Law, Dies at Age 94

Intel co-founder Gordon Moore has passed away

Gordon Moore, Intel's Co-Founder, Passes Away At 94



Netgear has been at the forefront of the SDVoE (Software-Defined Video over Ethernet) initiative with multiple AV switches serving the growing market. The ProAV lineup of managed switches have been sold primarily in a B2B setting by the Netgear Business division. These switches are increasingly becoming part of luxury residential installations requiring an AV-over-IP solution. As part of the CEDIA Expo 2022, Netgear is announcing a new 'Netgear Home Solutions' push. The intention is to take the same lineup of Netgear AV products sold by Netgear Business and target it towards both commercial and residential installations.

As part of this initiative, Netgear will be selling ProAV Managed Switches and ProWiFi Access Points to residential installers, along with the Pro version of Insight Remote Management and Pro Support. While the ProAV Managed Switches are already in the market, the new WAX628 and WAX638E APs are complementary to the currently existing [members of the Insight Access Point Portfolio](https://www.anandtech.com/show/17272).

[![](https://images.anandtech.com/doci/17592/ntgr-cedia-00_575px.png)](https://www.anandtech.com/show/17592/netgear-introduces-wifi-6-6e-access-points-and-services-for-residential-installers)

The WAX628 (already available for residential installers) slots in-between the dual-band AX3600 WAX620 and the tri-band AX6000 WAX630. This AX5400 dual-band solution supports 160 MHz channel bandwidth, and is accompanied by the AX7800 WAX638E which adds 6 GHz band support to the mix. The Wi-Fi 6E AP is slated to come to the market in the next few months.

Netgear is promising margin protection for installers by selling the ProAV and ProWiFi products only through the channel and not via Amazon or other e-tailers. Since these products are going to reach end-consumers through custom installers who have their own cost structures, the lack of any pricing information from Netgear is not surprising.

[![](https://images.anandtech.com/doci/17592/ntgr-cedia-01_575px.png)](https://www.anandtech.com/show/17592/netgear-introduces-wifi-6-6e-access-points-and-services-for-residential-installers)

Netgear's traditional consumer Wi-Fi router market has evolved rapidly over the last few years. Despite the success of Orbi (in both the consumer and SMB markets), new entrants like eero have gained significant mind and market share. In this context, Netgear has to look towards services and expand into new markets in order to maintain and build upon their technical leadership. Forays into lucrative niches like the residential installer market are not surprising.

Gallery: [Netgear Introduces Wi-Fi 6 / 6E Access Points and Services for Residential Installers](https://www.anandtech.com/Gallery/Album/8191)

[![](https://images.anandtech.com/galleries/8191/ntgr-cedia-00_carousel_thumb.png)](https://www.anandtech.com/Gallery/Album/8191#1)[![](https://images.anandtech.com/galleries/8191/ntgr-cedia-01_carousel_thumb.png)](https://www.anandtech.com/Gallery/Album/8191#2)[![](https://images.anandtech.com/galleries/8191/ntgr-cedia-carousel_thumb.png)](https://www.anandtech.com/Gallery/Album/8191#3)

[![](http://dynamic1.anandtech.com/www/delivery/avw.php?zoneid=24&cb=954250342&n=a1f2f01f)](http://dynamic1.anandtech.com/www/delivery/ck.php?n=a1f2f01f&cb=954250342)![](http://toptenreviews.122.2o7.net/b/ss/tmn-test/1/H.27.3--NS/0)

Netgear Introduces Wi-Fi 6 / 6E Access Points and Services for Residential Installers

Qualcomm this morning is taking the wraps off a pair of new SoCs for the mid-range and entry-level smartphone markets. Refreshing the company’s longstanding 600 and 400 series of chips, Qualcomm is announcing the Snapdragon 6 Gen 1 and Snapdragon 4 Gen 1. Both SoCs are receiving similar spec bumps, incorporating newer and faster IP blocks from Qualcomm – such as Arm Cortex-A78 derived CPU cores – as well as moving to newer, more contemporary manufacturing processes.

The Snapdragon 600/400 lineups were last updated in mid and early 2021 respectively, so as Qualcomm is already preparing for 2023, the time has finally come to update the bottom half of their product stack. Following Qualcomm’s broad cascading IP strategy, this generation of parts sees both SoC lineups migrate to Cortax-A78 CPUs for their main CPU cores, and in the case of the 6 Gen 1, doubling the number of high-performance CPU cores. Both SoCs also come with faster Adreno GPUs, though in traditional Qualcomm fashion, the company isn’t offering much in the way of details on the underlying hardware there.

Notably, however, Qualcomm’s 2023 mid-range/low-end parts aren’t making the jump to the Armv9 architecture. Unlike the 8 Gen 1 and 7 Gen 1, which incorporated Arm’s new Armv9 cores, Qualcomm’s cascading development strategy means that the 6 and 4 series will remain a bit farther behind the curve. For end users this should have little significance for the moment, but for smartphone vendors and software developers, it does mean Qualcomm won’t complete the Armv9 transition for at least another generation.

Meanwhile, coming up on nearly a year since Qualcomm announced their initial [Snapdragon 8 Gen 1 SoC](https://www.anandtech.com/show/17091/qualcomm-announces-snapdragon-8-gen-1-flagship-soc-for-2022-devices), today’s announcement from Qualcomm brings their remaining smartphone SoC families in alignment with their new product branding strategy. The 6 and 4 series pick up from where the 600 and 400 series left off, respectively, resetting the counted with the inaugural Gen 1 parts. Like the rest of simplified “Gen” series, this also means that Qualcomm is doing away with individual model numbers for its Kyro/Hexagon/Adreno/Spectra blocks, obfuscating a bit what generation of IP Qualcomm is using there.

Qualcomm Unveils Snapdragon 6 And 4 Gen 1 Platforms To Supercharge Midrange Devices

The new Snapdragon 6 Gen 1 and Snapdragon 4 Gen 1 will bring some premium features to affordable smartphones

Qualcomm Snapdragon 6 Gen 1 and Snapdragon 4 Gen 1 chips launch for mid-range and budget phones

Qualcomm Unveils Snapdragon 6 Gen 1 and 4 Gen 1 SoCs: Updating Mid-Range and Entry-Level Phones

Over the last decade or so, advancements in CPU and GPU architectures have combined extremely well with the relentless march of Moore's Law on the silicon front. Together, these have resulted in hand-held devices that have more computing power than huge and power-hungry machines from the turn of the century. On the desktop front, small form-factor (SFF) machines are now becoming a viable option for demanding professional use-cases. CAD, modeling, and simulation capabilities that required big iron servers or massive tower workstations just a few years back are now capable of being served by compact systems.

Workstation notebooks integrating top-end mobile CPUs and professional graphics solutions from AMD (FirePro) or NVIDIA (Quadro Mobile / RTX Professional) have been around since the mid-2000s. The advent of UCFF and SFF PCs has slowly brought these notebook platforms to the desktop. Zotac was one of the [early players](https://www.anandtech.com/show/12315/zotac-ces-2018-workstation-zbox-nvidia-quadro-p5000-p3000-p1000) in this market, and continues to introduce new products in the Zotac ZBOX Q Series. The company has two distinct lines - one with a notebook CPU and a professional mobile GPU (with a 2.65L volume), and another with a workstation CPU (Xeons up to 80W) and a professional mobile GPU (with a 5.85L volume).

Today, Lenovo is also entering the SFF workstation PC market with its ThinkStation P360 Ultra models. The company already has tiny workstations that do not include support for discrete GPUs, and that is fixed in the new Ultra systems. Featuring desktop Alder Lake with an Intel W680 chipset (allowing for ECC RAM option), these systems also optionally support discrete graphics cards - up to NVIDIA RTX A5000 Mobile. Four SODIMM slots allow for up to 128GB of ECC or non-ECC DDR5-4000 memory. Two PCIe Gen 4 x4 M.2 slots and a SATA III port behind a 2.5" drive slot are also available, with RAID possibility for the M.2 SSDs. Depending on the choice of CPU and GPU, Lenovo plans to equip the system with one of three 89% efficiency external power adapters - 170W, 230W, or 300W.

Gallery: [Lenovo ThinkStation P360 Ultra](https://www.anandtech.com/Gallery/Album/8158)

[![](https://images.anandtech.com/galleries/8158/01_P360_Ultra_Hero_Front_Facing_Right_thumb.jpg)](https://www.anandtech.com/Gallery/Album/8158#1)[![](https://images.anandtech.com/galleries/8158/02_P360_Ultra_Hero_Front_Facing_Left_thumb.jpg)](https://www.anandtech.com/Gallery/Album/8158#2)[![](https://images.anandtech.com/galleries/8158/03_P360_Ultra_Hero_Front_Facing_Right_thumb.jpg)](https://www.anandtech.com/Gallery/Album/8158#3)[![](https://images.anandtech.com/galleries/8158/04_P360_Ultra_Hero_Front_Facing_Left_thumb.jpg)](https://www.anandtech.com/Gallery/Album/8158#4)[![](https://images.anandtech.com/galleries/8158/05_P360_Ultra_Hero_Flat_Right_thumb.jpg)](https://www.anandtech.com/Gallery/Album/8158#5)[![](https://images.anandtech.com/galleries/8158/07_P360_Ultra_Tour_Front_Forward_Facing_thumb.jpg)](https://www.anandtech.com/Gallery/Album/8158#6)

The front panel has a USB 3.2 Gen 2 Type-A and two Thunderbolt 4 Type-C ports, as well as a combo audio jack. The vanilla iGPU version has four USB 3.2 Gen 2 Type-A ports, three DisplayPort 1.4 ports, and two RJ-45 LAN ports (1x 2.5 GbE, and 1x 1 GbE). On the WLAN front, the non-vPro option is the Wi-Fi 6 AX201, while the vPro one is the Wi-Fi 6E AX211. In addition to the PCIe 4.0 x16 expansion slot for the discrete GPU, the system also includes support for a PCIe 3.0 x4 card such as the Intel I350-T2 dual-port Gigabit Ethernet Adapter.

[![](https://images.anandtech.com/doci/17458/cut-out_575px.png)](https://www.anandtech.com/show/17458/lenovo-thinkstation-p360-ultra-melds-desktop-alder-lake-and-nvidia-professional-graphics)

With dimensions of 87mm x 223mm x 202mm, the whole package comes in at 3.92L. In order to cram the functionality into such a chassis, Lenovo has employed a custom dual-sided motherboard with a unique cooling solution, as indicated in the teardown picture above. A blower fan is placed above the two M.2 slots to ensure that thte PCIe Gen 4 M.2 SSDs can operate without any thermal issues.

[![](https://images.anandtech.com/doci/17458/cooling-01_575px.png)](https://www.anandtech.com/show/17458/lenovo-thinkstation-p360-ultra-melds-desktop-alder-lake-and-nvidia-professional-graphics)

As is usual for Lenovo's business / professional-oriented PCs, these systems are tested to military grade requirements and come with ISV certifications fro companies such as Autodesk, ANSYS, Dassault, PTC, Siemens, etc. Pricing starts at $1299 for the base model without a discrete GPU.

The ThinkStation P360 Ultra joins Lenovo's already-announced [P360 Tiny](https://www.lenovo.com/us/en/p/workstations/thinkstation-p-series/thinkstation-p360-tiny/30fa0023us) and the [P360 Tower](https://www.lenovo.com/us/en/p/workstations/thinkstation-p-series/thinkstation-p360-tower/len102s0006) models. The P360 Tiny doesn't support discrete GPUs, while the P360 Tower goes overboard with support for 3.5" drives, and up to four PCIe expansion cards, along with a 750W PSU. Most workstation use-cases can get by without all those bells and whistles. Additional options for the end consumer are always welcome, and that is where the P360 Ultra comes into play.

Lenovo’s Latest ThinkStation Shoves Big Specs in a Small Package

Lenovo's Latest ThinkStation Is A Diminutive Workhorse

Lenovo Announces ThinkStation P360 Ultra Desktop Workstation

Lenovo ThinkStation P360 Ultra Melds Desktop Alder Lake and NVIDIA Professional Graphics

Western Digital is announcing a host of consumer-focused SSD solutions today at its _What's Next Western Digital Event_. The gaming-focused WD\_BLACK is getting the SN850X NVMe SSD and the P40 Game Drive SSD, while the SN740 is now making an appearance as PCIe 4.0-capable M.2 2230 NVMe SSD under the regular _Western Digital_ brand.

The WD\_BLACK drives are slated for a summer release. The SN850X is a PCIe 4.0 x4 NVMe SSD with read speeds of up to 7300 MBps, and will be available in 1TB ($190 MSRP), 2TB, and 4TB capacities. The 1TB and 2TB models have an optional heat sink with RGB lighting included. Official datasheets with additional details are expected closer to launch in July 2022.

[![](https://images.anandtech.com/doci/17380/sn850x_575px.jpg)](https://www.anandtech.com/show/17380/western-digital-announces-wd_black-sn850x-nvme-and-p40-game-drive-ssds)

[![](https://images.anandtech.com/doci/17380/p40-rgb_575px.png)](https://www.anandtech.com/show/17380/western-digital-announces-wd_black-sn850x-nvme-and-p40-game-drive-ssds)

The P40 Game Drive SSD is a USB 3.2 Gen 2x2 (20Gbps) external drive that builds upon the [P50 model](https://www.anandtech.com/show/17052) by adding RGB lighting to the casing. It will be available in 500GB ($120 MSRP), 1TB, and 2TB capacities in summer 2022.

Western Digital also talked about the new 'Game Mode 2.0' feature in the WD\_BLACK Dashboard for unlocking additional performance-boosting features on Windows PCs. This mode is available for the SN850X NVMe SSD. The dashboard software can also be used with the P40 Game Drive to control the RGB lighting.

Western Digital Announces WD_BLACK SN850X NVMe and P40 Game Drive SSDs

The last few months have seen multiple vendors launch products in the Wi-Fi 7 (802.11be) space. Mediatek [demonstrated](https://corp.mediatek.com/news-events/press-releases/mediatek-shows-the-worlds-first-live-demos-of-wi-fi-7-technology-to-customers-and-industry-leaders) working 802.11be-compliant silicon under the Filogic lineup earlier this year. Concrete technical details and part numbers were not announced during the event. Last month, Broadcom [introduced](https://www.anandtech.com/show/17346) a comprehensive Wi-Fi 7 portfolio, detailing multiple 802.11be radios for access points, a networking SoC built keeping 802.11be bandwidth in mind, and a client radio for mobile applications.

### Wi-Fi 7 / 802.11be Background

The 802.11 Working Group's focus with 802.11be has been on extremely high throughput. This has been achieved primarily through a combination of three different aspects:

*   Support for up to 16 spatial streams
*   Support for channel widths up to 320MHz (with operation in 2.4 GHz, 5 GHz, and 6 GHz bands)
*   Support for 4096-QAM (4K-QAM) resulting in better utilization of available spectrum (a faster modulation / coding scheme).

It must be noted that wider channels are available only in the 5 GHz and 6 GHz bands.

[![](https://images.anandtech.com/doci/17369/03-chwd4qam_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

Theoretically, these aspects allow for up to around 46 Gbps of wireless throughput. 802.11be also aims to enable usage of Wi-Fi for real-time applications by including features for low-latency communications such as Multi-link operation (MLO). This allows a client and an access point to simultaneously communicate over multiple channels that might even belong to different bands.

[![](https://images.anandtech.com/doci/17369/04-mloop_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

The 802.11be specifications also allow for better performance in environments with heavy interference by permitting adaptive puncturing - the desired channel need not be necessarily contiguous. This improves on the preamble puncturing feature already available as part of the 802.11ax specifications.

[![](https://images.anandtech.com/doci/17369/05-adappunc_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

Interference and co-existence with non-Wi-Fi users of the same spectrum is handled using automatic frequency coordination (AFC). Unlike the Open AFC initiative (of which Broadcom is a part), Qualcomm is opting to provide its own turnkey solution for its customers.

[![](https://images.anandtech.com/doci/17369/07-qcomafc_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

As expected, AFC will require the device agent to be connected to the Internet for channel configuration and power modulation purposes.

### Qualcomm's Wi-Fi 7 Portfolio

At MWC 2022, Qualcomm had provided details of their 802.11be client silicon targeting mobile devices. The [FastConnect 7800](https://www.qualcomm.com/news/releases/2022/02/28/qualcomm-extends-connectivity-leadership-worlds-first-and-fastest-wi-fi-7) is expected to become available in H2 2022, and integrates Bluetooth 5.3 support with key Wi-Fi 7 features. Today, the company is introducing its Wi-Fi 7 Networking Pro Series access point platforms to expand its Wi-Fi 7 portfolio.

[![](https://images.anandtech.com/doci/17369/00-compecos_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

Qualcomm started marketing its Wi-Fi solutions under the Networking Pro and FastConnect monikers back in 2019, with the launch of its [Wi-Fi 6 solutions](https://www.anandtech.com/show/14789/qualcomm-wifi-6-2019). The 2nd generation products catered to the Wi-Fi 6E ecosystem, and it comes as no surprise that today's 3rd Gen. launch focuses on Wi-Fi 7.

The introduction of the Networking Pro tag has contributed to opaqueness in the composition of the router / AP platforms from a end-consumer perspective. Unlike Broadcom's public announcement of core details of the networking SoC, and characteristics of the various radio options for its reference designs, Qualcomm provides these details only to their customers. Eventually, these details do become public after market availability of the products. For example, the Networking Pro 800 platform's breakdown is available [here](http://www.bitswrt.com/ipq817x.html) - we see a core WiSoC with integrated MAC and baseband coupled with discrete radios. Therefore, it is disappointing that Qualcomm has not given us much to analyze in today's announcements beyond basic product specifications. These high-level feature specifications match the features in Broadcom's products announced last month.

[![](https://images.anandtech.com/doci/17369/01-imhmnpro_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

It must be noted that Qualcomm also provides the 'Immersive Home' platform for entry-level Wi-Fi routers. These are typically similar to the 'Networking Pro' platforms, except for cut-down stream counts and reduced WiSoC capabilities in terms of CPU core counts and frequencies. Given that Qualcomm refused to provide any details of CPU core counts or frequencies for the Networking Pro series being launched today, we need to wait for an official announcement related to their Wi-Fi 7 portfolio for the cost-sensitive segment.

The 3rd Gen. Networking Pro series consists of four members, with stream counts ranging from 6 in the Networking Pro 620 to 16 in the Networking Pro 1620. Radio options exist for two or four streams in each of the 2.4 GHz, 5 GHz, and 6 GHz bands.

[![](https://images.anandtech.com/doci/17369/02-npro3gen_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

Qualcomm claims peak system PHY rates of up to 33 Gbps, and per-channel wireless PHY rates of more than 10 Gbps, with the capability of supporting more than 500 users in each channel.

The availability of 6 GHz spectrum for Wi-Fi is not universal. Qualcomm indicated that different configurations of the Networking Pro 3rd Gen series are possible, based on the allocation.

[![](https://images.anandtech.com/doci/17369/06-band2cfg_575px.png)](https://www.anandtech.com/show/17369/qualcomm-launches-wifi-7-networking-pro-series-for-10gbps-access-points)

Qualcomm's Wi-Fi 7 Networking Pro series will allow its customers to create a wide range of enterprise-class and premium wireless access points / routers. The platforms are already sampling - we should be seeing market availability of BE10000, BE16000, BE21000, and BE33000 Wi-Fi routers based on them in a few quarters.

5G-based fixed wireless access is fast becoming an attractive option for many consumers - sometimes even as the primary broadband connection. Qualcomm's strengths in 5G will act as an asset from a bundling perspective for integrated Wi-Fi 7 / 5G platforms. However, Broadcom has significant presence with service providers for 10G PON and DOCSIS 4.0. It is likely that those high-speed ISPs will find Broadcom's possible bundled offerings attractive for their Wi-Fi 7-capable consumer gateways. While we wait for Mediatek and MaxLinear (to whom Intel sold their Home Gateway Platform Division) to reveal their Wi-Fi 7 cards fully, it appears that initial battle will be between products based on Qualcomm's 3rd Gen. Networking Pro series and those using Broadcom's Wi-Fi 7 portfolio.

Qualcomm Launches Wi-Fi 7 Networking Pro Series for 10Gbps Access Points

Kicking off what’s set to be a busy May, this morning the Video Electronics Standards Association (VESA), the PC display industry’s primary consortium, is rolling out a new set of performance standards for variable refresh rate displays. Dubbed AdaptiveSync and MediaSync, these new test standards are designed to offer an industry-neural and open specification for the behavior and performance of DisplayPort displays. AdaptiveSync is a standard designed for high-end gaming displays, while MediaSync is aimed at eliminating video jitter on a much wider array of devices.

VESA Launches Variable Refresh Display Performance Standards: AdaptiveSync and MediaSync

Kioxia this morning is rolling out its next-generation of full-size client SSDs, the XG8 family. Like its predecessors, the XG8 is aimed at the OEM market, for customers who are after a full M.2 2280-sized drive and are looking for better performance than the company’s more integrated and compact BG-series drives. Notable features for the latest-generation drive include a PCIe 4.0-capable controller, as well as capacities as high as 4TB.

And while we’d normally use the company’s previous-generation drive as a baseline to illustrate what’s new with the latest drive, today’s announcement of the XG8 is a bit weird, even by Kioxia’s own OEM-centric standards. The predecessor to the XG8 is the [XG7](https://www.anandtech.com/show/16231/kioxia-announces-xg7-pcie-40-client-ssds), which was launched in November of 2020 with a very similar feature set: a PCIe 4.0 M.2 2280 SSD with capacities up to 4TB. However, for reasons we’re still not entirely clear on, the XG7 only saw a very limited deployment among OEMs, to the point that Kioxia never even put together a proper product page for the part. As a result, the company is taking a mulligan of sorts and is starting fresh with the XG8, positioning it as the successor to the PCIe 3/BiCS4-based [XG6](https://www.anandtech.com/show/13254/the-toshiba-xg6-1tb-ssd-review-first-96l-3d-nand).

Kioxia XG8 SSD Specifications

Capacity

512 GB

1 TB

2 TB

4 TB

Form Factor

M.2 2280

Interface

PCIe Gen4 x4, NVMe 1.4

NAND Flash

112L BiCS5 3D TLC

Starting with the basics, the XG8 is a M.2 2280 form factor SSD with a PCIe 4.0 x4 connection. Kioxia is using their 5th generation, 112-layer BiCS5 NAND, with capacities ranging from 512GB up to 4TB. That NAND is being paired with their own in-house controller, which offers NVMe 1.4 support as well as the option for the usual OEM-centric security features such as TCG Pyrite 2.01 and TCG Opal 2.01.

Kioxia classifies the drive as a high-end product – particularly in relation to the [BG5](https://www.anandtech.com/show/17068/kioxia-updates-m2-2230-ssd-lineup-with-bg5-series-adding-pcie-40-and-bics5-nand) – though as this is again by OEM standards, it’s a bit up in the air by enthusiast standards. Unfortunately, Kioxia isn’t providing any hard performance figures in advance of today’s announcement, so we don’t even have on-paper numbers to go by. For the moment, Kioxia is primarily throwing around 2x the performance of the XG6, most of which I’d expect to come from the switch to PCIe 4.0 and the additional host-to-controller bandwidth that affords.

Based on the lack of specification information and the fact that so many figures line up with the absentee XG7, it’s not at all clear what sets the XG8 apart from its more recent sibling. Presumably something has changed, if only to avoid another misfire, but at this point we’d just be guessing. Though it is notable that this drive family appears to be doing away with the ‘P’ designation that Kioxia used for high capacity drives in previous generations (e.g. XG6-P), as there is no mention of that sub-family of drives this time around.

Finally, this is probably one of the last BiCS5 client drives we’ll see from Kioxia. The WD/Kioxia joint venture has been producing BiCS5 NAND since late 2020, and according to recent WD earnings calls, 162L BiCS6 is expected to go into mass production late this year.

In the meantime, the XG8 is now sampling to Kioxia’s customers, and should start showing up in OEM laptops and desktops soon.

Kioxia Announces XG8 Client SSDs: PCIe 4.0 and BiCS5 For OEMs

Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of its clients' needs, the company will have to keep offering half-nodes, enhanced, and specialized versions of its fabrication processes.TSMC's success in the last 20 years or so was largely conditioned by the company's ability to offer a new manufacturing technology with PPA (power, performance, area) improvements every year and introduce a brand-new node every 18 – 24 months while maintaining predictably high yields. But as complexity of modern fabrication processes gets to unprecedented levels, it is getting much harder to keep the pace of innovation while also sustaining predictable yields and simple design principles.With TSMC's [N3 node](https://www.anandtech.com/show/16024/tsmc-details-3nm-process-technology-details-full-node-scaling-for-2h22), the gap between N5 (5 nm-class) ramp up and N3 (3 nm-class) ramp up will increase to around 2.5 years, which may pose some challenges to the foundry's key customer, Apple. The good news is that N3's follow up, N3E, seems to be coming in ahead of schedule. Meanwhile, with N2, the cadence is set to stretch to about three years, which largely means a strategic shift in TSMC's strategy of node development.

TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming

The last few years have seen heightened consumer focus on wireless networking. The industry has also been quite busy, enabling the operation of Wi-Fi 6 (802.11ax) in the 6GHz band with Wi-Fi 6E. In parallel, the 802.11 Working Group had started work on 802.11be with a focus on extremely high throughput (EHT). Wi-Fi 7 is set to become the consumer-facing moniker for 802.11be.

802.11be aims to achieve high throughput primarily through a combination of three aspects:

*   Support for up to 16 spatial streams
*   Support for 320MHz-wide channels (with operation in 2.4 GHz, 5 GHz, and 6 GHz bands)
*   Support for 4096-QAM (4K-QAM) resulting in better utilization of available spectrum (a faster modulation / coding scheme).

Theoretically, these aspects allow for up to around 46 Gbps of wireless throughput. 802.11be also aims to enable usage of Wi-Fi for real-time applications by including features for low-latency communications such as Multi-link operation (MLO). This allows a client and an access point to simultaneously communicate over multiple channels that might even belong to different bands. Interference and co-existence with non-Wi-Fi users of the same spectrum is handled using automatic frequency coordination (AFC).

[![](https://images.anandtech.com/doci/17346/wifi7-features_575px.png)](https://www.anandtech.com/show/17346/broadcom-launches-wifi-7-portfolio-for-access-points-and-client-devices)

A number of additional features targeting these two thrust areas are under consideration for the final standard. However, multiple silicon vendors have already started introducing silicon supporting variations of the aspects included in the first 802.11be draft specifications.

Mediatek was one of the first vendors to [demonstrate](https://corp.mediatek.com/news-events/press-releases/mediatek-shows-the-worlds-first-live-demos-of-wi-fi-7-technology-to-customers-and-industry-leaders) working 802.11be-compliant silicon earlier this year. Though Mediatek indicated that the products would be marketed under the Filogic lineup, concrete technical details and part numbers were not announced. At MWC 2022, Qualcomm provided details of their 802.11be client silicon targeting mobile devices. The [FastConnect 7800](https://www.qualcomm.com/news/releases/2022/02/28/qualcomm-extends-connectivity-leadership-worlds-first-and-fastest-wi-fi-7) is expected to become available in H2 2022, and integrates Bluetooth 5.3 support with key Wi-Fi 7 features.

Broadcom is announcing a comprehensive portfolio of products targeting various Wi-Fi 7 markets today.

[![](https://images.anandtech.com/doci/17346/brcm-prod-eco_575px.png)](https://www.anandtech.com/show/17346/broadcom-launches-wifi-7-portfolio-for-access-points-and-client-devices)

The table below summarize the key features of the products targeting access points. All of these support 4K-QAM and Multi-Link Operation.

Broadcom 802.11be (Wi-Fi) Access Point Radios Specifications

 

BCM67263

BCM6726

BCMN43740

BCMN43720

Target Market

Residential Wi-Fi APs

Enterprise Wi-Fi APs

Operational Band

6 GHz

2.4 GHz (or) 5 GHz (or) 6 GHz

Stream Count

4

2

Max. Channel Width

320 MHz

160 MHz

320 MHz

160 MHz

PHY Rate

11.5 Gbps

5.75 Gbps

11.5 Gbps

2.88 Gbps

The AP products support AFC in order to ensure that 6GHz range is not affected (the APs are mandated to receive regularly scheduled clearance from a central authority to prevent interference with 6 GHz spectrum users). Broadcom has applied to be an AFC operator and will offer AFC service with their chips. This will use [Open AFC code](https://www.broadcom.com/blog/open-afc-is-the-key-to-next-generation-6ghz-wi-fi). Broadcom also believes a vibrant Wi-Fi 7 ecosystem requires an AFC service that the device makers can use independent of the chip vendor. Organizations such as the Wi-Fi Alliance, and Wireless Broadband Alliance have applied to be AFC operators, with Open AFC already gaining traction in this.

Tying these together in Broadcom's Wi-Fi 7 router reference design is the BCM4916 network processor. This ARM v8-compatible quad-core SoC includes a dual-issue Runner packet processor (DI-XRDP), an integrated NBASE-T (up to 10G) Ethernet PHY for WAN or LAN, four integrated 1GbE PHYs, three USXGMII interfaces, multiple USB ports, and a 32-bit DDR3/DDR4 DRAM interface.

[![](https://images.anandtech.com/doci/17346/bcm4916nproc_575px.png)](https://www.anandtech.com/show/17346/broadcom-launches-wifi-7-portfolio-for-access-points-and-client-devices)

The quad-core CPU is a custom Broadcom design with 64KB of L1 cache and 1MB of L2 cache, providing up to 24K DMIPS horsepower. Without the knowledge of exact clock speeds, it is difficult to compare against the standard Cortex cores from ARM. Based on the DMIPS number, this appears to slot in-between a Cortex-A53 and an A57, but does not include the ARM v8.2 features of the A55.

[![](https://images.anandtech.com/doci/17346/wifi7-ref-design_575px.png)](https://www.anandtech.com/show/17346/broadcom-launches-wifi-7-portfolio-for-access-points-and-client-devices)

Broadcom's customers can play around with the radio configuration in the above design to create products at different price points. Tri-band support becomes compulsory in Wi-Fi 7. The extremely high throughput enabled by this means that 10G support on the WAN/LAN side and NBASE-T support on the LAN front will become the de-facto standard for routers and APs in the coming years.

Broadcom is also introducing the BCM4398 - an integrated Wi-Fi 7 and Bluetooth 5 combo chip targeting smartphones and other mobile applications. It supports two streams of Wi-Fi 7, channel width of up to 320 MHz, and a 6.05 Gbps PHY rate. On the client side, one of the key user-visible updates is low-latency operation. Broadcom claims that the BCM4398 can achieve sub-millisecond latencies for lightly congested environments in the 6 GHz band. The client multi-link operation feature can keep both uplink and downlink latencies between 5 and 10ms in situations where both 5 and 6 GHz bands are highly congested. This provides determinism for AR/VR knowing that worst case latencies will be down to a few milliseconds even during heavy congestion.

[![](https://images.anandtech.com/doci/17346/wifi7-adv-last_575px.png)](https://www.anandtech.com/show/17346/broadcom-launches-wifi-7-portfolio-for-access-points-and-client-devices)

Broadcom is the first vendor to announce a complete portfolio of Wi-Fi 7 products, with sampling for key customers already in progress. The new products should give end-consumers a taste of the values delivered by Wi-Fi 7 for different applications a few quarters from now.

AnandTech